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MULTILAYER DOWN-CONVERTING ENCAPSULANT FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME 发明授权

2023-06-29 3620 180K 0

专利信息

申请日期 2025-06-25 申请号 EP13896824
公开(公告)号 EP3066695B1 公开(公告)日 2018-12-26
公开国别 EP 申请人省市代码 全国
申请人 Dow Global Technologies LLC; Rohm and Haas Company
简介 A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.


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