| 申请日期 | 2025-07-10 | 申请号 | US14943747 |
| 公开（公告）号 | US9974171B2 | 公开（公告）日 | 2018-05-15 |
| 公开国别 | US | 申请人省市代码 | 全国 |
| 申请人 | BYD COMPANY LIMITED | ||
| 简介 | Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises : an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof. | ||
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