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ELECTRONIC COMPONENT JOINING ALLOY WITH EXCELLENT JOINING CHARACTERISTIC UNDER HIGH TEMPERATURE AND 发明授权

2023-10-17 3930 641K 0

专利信息

申请日期 2026-03-27 申请号 KR1020160109028
公开(公告)号 KR101825302B1 公开(公告)日 2018-02-02
公开国别 KR 申请人省市代码 全国
申请人 KOREA UNIVERSITY OF TECHNOLOGY AND EDUCATION INDUSTRY UNIVERSITY COOPERATION FOUNDATION
简介 The present invention relates to a thermoelectric element joining alloy and a paste thereof. The thermoelectric element is formed with a dispersion prevention layer including 10-90 wt% of transition metal alloy powder and 90-10 wt% of rare-earth metal alloy powder, and the thermoelectric element joining alloy for joining an upper portion electrode or a lower portion electrode are provided, or the paste for joining the thermoelectric element including 50-80 wt% of thermoelectric element joining alloy powder and 20-50 wt% of organic solvent. Thus, a gap between selected materials among a metal and a metal, a metal and a semiconductor, a metal and a ceramic, a semiconductor and a semiconductor, a semiconductor and a ceramic, and a ceramic and a ceramic is joined, and a joining property can be maintained in a high temperature.COPYRIGHT KIPO 2018


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