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Heating Assembly 发明申请

2023-12-16 1690 131K 0

专利信息

申请日期 2025-06-28 申请号 US15659207
公开(公告)号 US20180030587A1 公开(公告)日 2018-02-01
公开国别 US 申请人省市代码 全国
申请人 ROPEX Industrie Elektronik GmbH
简介 A heating assembly for a thermal joining device, the heating assembly including a base body, through which a fluid passage passes and which is provided on an external surface with a heating device having a ceramic substrate designed as a thick-film ceramic material and a metallic heating conductor, wherein the heating conductor is produced from an anti-adhesion alloy, and/or wherein the heating conductor is coated with an anti-adhesion alloy coating, the anti-adhesion alloy containing a proportion of at least 5 percent by weight of at least one element from the group of the metals of the rare earths.


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