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PACKAGING METHOD FOR HIGH GAMUT WHITE LIGHT QUANTUM DOT LED 发明申请

2023-04-16 3680 1151K 0

专利信息

申请日期 2025-09-17 申请号 WOCN16110965
公开(公告)号 WO2017166871A1 公开(公告)日 2017-10-05
公开国别 WO 申请人省市代码 全国
申请人 SHENZHEN JUFEI OPTOELECTRONICS CO LTD
简介 Disclosed in the present invention is a packaging method for high gamut white light quantum dot LED, which comprises the following steps : a, adding an organic solvent to a red light quantum dot fluorescent powder and a blue light quantum dot fluorescent powder, respectively; b, carrying out ultrasonic processing on the solution; c, preparing a mixed quantum dot solution; d, adding a mixed packaging glue to the mixed quantum dot solution and stirring well; e, removing the organic solvent; f, adding a green light rare earth fluorescent powder; and g, dropping the mixed fluorescent glue to an LED support fixed with an ultraviolet chip, baking and curing to obtain an LED light bead. The packaging method of the present invention can prepare high gamut white light LED, which greatly increases the gamut value of the LED back-light bead to NTSC 92% or higher. The organic solvent serves as a connection bridge, so that quantum dots and the packaging glue are uniformly mixed, thus preventing the agglomeration failure phenomenon of the quantum dot fluorescent powder, as well as significantly improving the quality of the high gamut white light LED bead.


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