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The ceramic sintered body and the imaging device package 发明授权

2023-04-29 1410 88K 0

专利信息

申请日期 2025-06-25 申请号 JP2014028627
公开(公告)号 JP6204219B2 公开(公告)日 2017-09-27
公开国别 JP 申请人省市代码 全国
申请人 京セラ株式会社
简介 PROBLEM TO BE SOLVED : To provide a ceramic sintered body having low reflectance, high thermal conductivity, high thermal expansion coefficient and high insulating resistance, and to provide a package using the same.SOLUTION : There is provided a ceramic sintered body which contains magnesium oxide as a main component, a main material containing 2 to 10 mass% of a rare earth element(RE) in terms of REOand 0.1 to 2.0 pts.mass of molybdenum in terms of MoObased on 100 pts.mass of the main material. There is provided a package comprising the ceramic sintered body as an insulation substrate 3. Thus, there can be obtained a ceramic sintered body having high thermal conductivity, high thermal expansion coefficient, high insulating resistance, and low reflectance and a package.


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