| 简介 |
PROBLEM TO BE SOLVED : To provide a phenolic resin composition excellent in metal adhesivity and heat resistance of its cured material.SOLUTION : The phenolic resin composition contains a phenolic resin and a disulfide compound, and the disulfide compound contains a compound represented by formula (1) and a compound represented by formula (2). R-S-S-R...(1) wherein Rand Rare hydrogen, or a 1-16C aliphatic group or an aromatic group having a hydroxyl group, a mercapto group, a carboxyl group, an amino group or an amide group, and may be identical or different. In formula (2), n is an integer of 1 to 6; Rto Rare hydrogen, a hydroxyl group, a mercapto group, a carboxyl group, an amino group or an amide group, or a 1-16C aliphatic group or an aromatic group having these substituents, and may be identical or different. |
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