客服热线:18202992950

Wiring structure for display device 发明申请

2023-03-26 1510 91K 0

专利信息

申请日期 2025-06-27 申请号 JP2016020018
公开(公告)号 JP2017139381A 公开(公告)日 2017-08-10
公开国别 JP 申请人省市代码 全国
申请人 KOBELCO KAKEN : KK
简介 PROBLEM TO BE SOLVED : To provide a wiring structure for a display device, which is not only superior in heat resistance when subjected to a high-temperature heat treatment at 450-600°C, and which can hold down an electric resistance further even after high-temperature heating.SOLUTION : A wiring structure according to the invention comprises a laminate structure which includes, from a substrate side in turn, a first layer of an Al alloy including 0.1-3.0 atom% of a rare earth element with the balance consisting of Al and inevitable impurities, and a second layer composed of a nitride film of Mo, Ti, a Mo alloy or a Ti alloy. The first layer has a film thickness of 80-700 nm, and the second layer has a film thickness of over 10 to 70 nm. When the Al alloy is heated at a temperature of 450-600°C for 2 hours or shorter time, the maximum crystal grain diameter of the Al alloy is 0.8-10 μm. When the wiring structure is heated at a temperature of 450-600°C, the electric resistance of the first layer is 4.5 μΩcm or less, and the hillock density is less than 1×109/m2.SELECTED DRAWING : NoneCOPYRIGHT : (C)2017, JPO&INPIT


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4