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The positive type radiation-sensitive resin composition, and method of forming the cured film, the 发明授权

2023-05-02 1840 534K 0

专利信息

申请日期 2025-07-09 申请号 JP2016152356
公开(公告)号 JP6168212B2 公开(公告)日 2017-07-26
公开国别 JP 申请人省市代码 全国
申请人 JSR株式会社
简介 PROBLEM TO BE SOLVED : To provide a positive-type radiation-sensitive resin composition capable of forming a cured film excellent in storage stability and in addition, sufficiently satisfying general characteristics such as sensitivity, developing adhesion, heat resistance, chemical resistance, transmittance and dielectric constant while retaining good surface hardness.SOLUTION : The positive-type radiation-sensitive resin composition contains : [A] a polymer having a structural unit (I) containing at least one selected from a group represented by the formula (1) and a group represented by the formula (2) and a structural unit (II) containing an oxetane structure; and [B} an acid generator. In the formula (1), Rand Rare a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or a fluorinated alkyl group having 1 to 4 carbon atoms. In the formula (2), Rand Rare a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms or a fluorinated alkyl group having 1 to 4 carbon atoms.SELECTED DRAWING : None


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