客服热线:18202992950

Flexible Copper Clad Laminate and Method for Manufacturing The Same 发明申请

2023-04-22 1250 468K 0

专利信息

申请日期 2025-08-28 申请号 KR1020160001379
公开(公告)号 KR1020170082230A 公开(公告)日 2017-07-14
公开国别 KR 申请人省市代码 全国
申请人 LS MTRON LTD
简介 Disclosed is a flexible copper-clad laminated film having a high grain-termination ratio and a copper-plated layer with improved bendability, and a method of producing the same. The method of producing the flexible copper clad laminate film of the present invention comprises : a step of preparing a nonconductive polymer substrate; a step of forming a tie coat layer on the nonconductive polymer substrate; a step of forming a copper seed layer on the tie coat layer through a sputtering process; and a step of forming a copper plating layer on the copper seed layer through an electrolytic plating process, wherein the plating solution used in the electrolytic plating process includes copper sulfate and a rare earth metal.COPYRIGHT KIPO 2017


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4