| 简介 |
PROBLEM TO BE SOLVED : To provide a pressure-sensitive adhesive composition that is used in a heat-resistant adhesive film hardly causing a contamination when peeled from an adherend after used under high-temperature conditions.SOLUTION : A pressure-sensitive adhesive composition for heat-resistant adhesive film comprises an acrylic resin (A) obtained by copolymerizing a copolymerization component [I] comprising a (meth)acrylate-based monomer (a1) as a main component. The pressure-sensitive adhesive composition for heat-resistant adhesive film comprises a dialkyl(meth) acrylamide-based monomer (a2) represented by general formula (1) (wherein Ris a hydrogen atom or methyl; Rand Rare each alkyl) as the copolymerization component [I]. |
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