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ALLOY SOLDER, AND PREPARATION METHOD THEREFOR AND USE THEREOF 发明申请

2023-05-24 4060 1321K 0

专利信息

申请日期 2025-06-29 申请号 WOCN16089967
公开(公告)号 WO2017101436A1 公开(公告)日 2017-06-22
公开国别 WO 申请人省市代码 全国
申请人 WANG Nengqing
简介 Provided is a low-temperature alloy solder, comprising, in parts by weight : 17-35 parts of tin, 20-45 parts of lead, 20-40 parts of bismuth, 0.1-2 parts of indium, 0.1-0.5 parts of antimony, 0.01-0.2 parts of phosphorus and 0.01-0.8 parts of a rare earth element. The alloy solder takes a tin-lead-bismuth three-phase alloy as a main component, has a melting point lower than 145°C, is suitable for a laminating process of a photovoltaic module, and realizes the integration of the welding process and the laminating process of a main-grid-free battery. Further disclosed is a preparation method for the alloy solder and a use thereof.


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