| 简介 |
PROBLEM TO BE SOLVED : To provide a phenolic resin composition excellent in adhesion to metals and heat resistance of a cured product.SOLUTION : The phenolic resin composition contains a phenolic resin and a disulfide compound. The disulfide compound contains a compound represented by formula (1) and/or formula (2), and the phenolic resin contains a benzoxazine resin. (In the formula (1), Rand Rare each independently H, a hydroxyl group, a mercapto group, a carboxyl group, or a 1-16C hydrocarbon group having an amide group.) (In the formula (2), n is an integer of 1-6; and Rto Rare each independently H, a hydroxyl group, a mercapto group, a carboxyl group, an amino group, an amide group, or a 1-16C hydrocarbon group having a substituent.)SELECTED DRAWING : None |
客服热线：
手机版
二维码
