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MEMBER FOR PLASMA PROCESSING DEVICE AND PLASMA PROCESSING DEVICE PROVIDED WITH SAME 发明申请

2023-12-05 2500 1013K 0

专利信息

申请日期 2025-07-28 申请号 US17299221
公开(公告)号 US20220042161A1 公开(公告)日 2022-02-10
公开国别 US 申请人省市代码 全国
申请人 KYOCERA Corporation
简介 Provided are a member for plasma processing device which has an excellent plasma resistance and improved adhesion strength of a film to a base material, and a plasma processing device provided with the same. A member for plasma processing device includes : a base material containing a first element which is a metal element or a metalloid element; a film containing a rare-earth element oxide, or a rare-earth element fluoride, or a rare-earth element oxyfluoride as a major constituent, the film being located on the base material; and an amorphous portion containing the first element, a rare earth element, and at least one of oxygen and fluorine, the amorphous portion being interposed between the base material and the film.


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