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METHOD FOR ETCHING OBJECT TO BE PROCESSED 发明申请

2023-05-06 4180 1448K 0

专利信息

申请日期 2025-07-31 申请号 KR1020177001874
公开(公告)号 KR1020170048321A 公开(公告)日 2017-05-08
公开国别 KR 申请人省市代码 全国
申请人 TOKYO ELECTRON LTD
简介 In one embodiment, a method for etching a workpiece including a lower electrode and a multi-layer film disposed on the lower electrode, the multi-layer film including a first magnetic layer, a second magnetic layer, and an insulating layer interposed between the first magnetic layer and the second magnetic layer, through a mask, is provided. The method includes exposing the workpiece to plasma of first processing gas which contains first rare gas and second rare gas having an atomic number larger than that of the first rare gas, and does not contain hydrogen gas.


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