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Nickel electroplating apparatus 发明授权

2023-09-15 4800 135K 0

专利信息

申请日期 2025-08-16 申请号 JP2013061649
公开(公告)号 JP6119353B2 公开(公告)日 2017-04-26
公开国别 JP 申请人省市代码 全国
申请人 日立金属株式会社
简介 The invention provides an eliminating device for a rare earth impurity in a nickel plating solution. The invention provides a device which can relatively simply and effectively eliminate the rare earth impurity which deposits in a plating solution and causes inferior plating when a rare-earth magnet is plated. The eliminating device comprises the components of : a heating unit, a cooling unit and a separation eliminating unit. The nickel plating solution in which the rare earth impurity is dissolved is heated through the heating unit for making the rare earth impurity become precipitation. Then the cooling unit is utilized for cooling the heated nickel plating solution to a temperature for performing plating treatment. The separation eliminating unit is used for separating and eliminating the precipitation of the rare earth impurity.


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