| 简介 |
PROBLEM TO BE SOLVED : To provide a semiconductor module which achieves a cost advantage by a simple manufacturing process and achieves high accuracy at the time of solder connection by columnar metal bodies having uniform heights.SOLUTION : A semiconductor module comprises : a semiconductor element 30 having an electrode 31 on a top face; a lower wiring board 20 having a bottom face fixed to the top face; an upper wiring board 10 having a plurality of columnar metal bodies 14 arranged at positions opposite to the electrode 31 of the semiconductor element 30 and a wiring pattern 11a integrally formed with the columnar metal bodies 14; and a lateral terminal member 36 arranged lateral to the upper wring board, in which the plurality of columnar metal bodies 14 are formed from a metal plate by etching; the electrode 31 and the columnar metal bodies 14 rare connected by a solder; the upper wiring board 10 extends to the lateral terminal member 36; and the wiring pattern 11a is electrically connected to the lateral terminal member 36. |
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