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Cu-Ni-Co-Si-BASED HIGH STRENGTH COPPER ALLOY THIN SHEET MATERIAL AND MANUFACTURING METHOD THEREFOR, 发明申请

2023-04-28 4240 217K 0

专利信息

申请日期 2025-06-26 申请号 JP2015164471
公开(公告)号 JP2017043789A 公开(公告)日 2017-03-02
公开国别 JP 申请人省市代码 全国
申请人 DOWA METALTECH KK
简介 PROBLEM TO BE SOLVED : To provide a sheet material of a Cu-Ni-Co-Si-based copper alloy having extremely thin sheet thickness, high in 0.2% bearing force, providing high dimensional accuracy when processed to a precision component such as a lead frame and having good shape. SOLUTION : There is provided a copper alloy thin sheet material having a chemical composition containing, by mass%, total of Ni and Co : 2.50 to 4.00%, Co : 0.50 to 2.00%, Si : 0.50 to 1.50%, Fe : 0 to 0.50%, Mg : 0 to 0.10%, Sn : 0 to 0.50%, Zn : 0 to 0.15%, B : 0 to 0.10%, P : 0 to 0.10%, REM (rare earth element) : 0 to 0.10%, total content of Cr, Zr, Hf, Nb and S of 0 to 0.05% and the balance Cu with inevitable impurities, sheet thickness of 15 μm or more and less than 100 μm, 0.2% bearing force in a rolling direction of 1000 MPa or more and extremely small width warpage. SELECTED DRAWING : None COPYRIGHT : (C)2017, JPO&INPIT


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