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The fluorene compound and an epoxy compound having a phenolic hydroxyl group 发明授权

2023-08-23 3470 277K 0

专利信息

申请日期 2025-07-06 申请号 JP2013119971
公开(公告)号 JP6087738B2 公开(公告)日 2017-03-01
公开国别 JP 申请人省市代码 全国
申请人 大阪ガスケミカル株式会社; 群栄化学工業株式会社
简介 PROBLEM TO BE SOLVED : To provide a novel epoxy compound which has characteristics such as heat resistance, mechanical properties, handleability, and solvent solubility in good balance.SOLUTION : A phenol as a raw material has a fluorene structure represented by formula (1) (where rings Zand Zare each an aromatic hydrocarbon ring; Rand Rare each a substituent; Ris H or a hydrocarbon group; Ris a substituent not being a hydroxyl group; k is an integer of 0-4; m and p are each an integer of 0 or more; and n, q, and r are each an integer of 1 or more).


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