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An etchant composition etching method 发明授权

2023-09-23 5080 231K 0

专利信息

申请日期 2025-06-29 申请号 JP2013066282
公开(公告)号 JP6078394B2 公开(公告)日 2017-02-08
公开国别 JP 申请人省市代码 全国
申请人 株式会社ADEKA
简介 PROBLEM TO BE SOLVED : To provide an etchant composition with which, when collectively etching a laminate film consisting of an indium oxide-based coating film and a metal-based coating film, a reduction in a width of a formed fine line consisting of the indium oxide-based coating film and the metal-based coating film is small and mouse bites of the fine line are not caused.SOLUTION : An etchant composition for collectively etching a laminate layer consisting of an indium oxide-based coating film and a metal-based coating film consists of an aqueous solution containing (A) at least one or more kinds of oxidant components selected from ferric ion and cupric ion, (B) hydrochloric acid component, (C) at least one or more kinds of compound components selected from a group of compounds represented by following general formula (1) and straight or branched alcohols having 1 to 4 carbon atoms, and (D) at least one or more kinds of acid components selected from sulfuric acids or phosphoric acids. In the general formula (1), Rand Rare each independently hydrogen, or a straight or branched alkyl group having 1 to 4 carbon atoms, Ris a straight or branched alkylene group having 1 to 4 carbon atoms, and n is the number of 1 to 3.


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