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Photosensitive resin composition 发明授权

2023-03-21 2860 442K 0

专利信息

申请日期 2025-07-11 申请号 JP2012218646
公开(公告)号 JP6073626B2 公开(公告)日 2017-02-01
公开国别 JP 申请人省市代码 全国
申请人 旭化成株式会社
简介 PROBLEM TO BE SOLVED : To provide a positive photosensitive resin composition having good lithographic performances such as high sensitivity and high resolution, having a high film residual rate after being cured and giving a good pattern cross-sectional shape after being cured.SOLUTION : The positive photosensitive resin composition comprises (A) 100 parts by mass of an alkali-soluble resin, (B) 1 to 50 parts by mass of a photo-acid generator, and (C) 0.1 to 10 parts by mass of a salicylic acid oligomer expressed by general formula (1) or its mixture. In the formula, Rand Reach independently represent a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms; an average of n is 0 or more and 5.0 or less; and when an average of n is 0, it is not allowed that both of Rand Rare simultaneously hydrogen atoms.


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