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The curable silicone composition and optical semiconductor device 发明申请

2023-12-18 2950 248K 0

专利信息

申请日期 2025-06-27 申请号 JP2014551167
公开(公告)号 JPWO2014088115A1 公开(公告)日 2017-01-05
公开国别 JP 申请人省市代码 全国
申请人 東レ・ダウコーニング株式会社
简介 A curable silicone composition which is composed of at least (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups in each molecule, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in each molecule, (C) at least one fine powder that is selected from the group consisting of fine zinc oxide powders that are surface-coated with an oxide and/or hydroxide of at least one element that is selected from the group consisting of Al, Ag, Cu, Fe, Sb, Si, Sn, Ti, Zr and rare earth elements, fine zinc oxide powders that are surface-coated with an organosilicon compound having no alkenyl group, and fine powders of zinc carbonate hydrates, and (D) a catalyst for hydrosilylation reaction. This curable silicone composition has excellent storage stability, and is cured to form a cured product that is suppressed in yellowing due to thermal aging and that sufficiently suppresses discoloration of a silver electrode or silver plating of a substrate in an optical semiconductor device, said discoloration being caused by a sulfur-containing gas in the air


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