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CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE 发明申请

2023-10-02 3960 150K 0

专利信息

申请日期 2025-07-09 申请号 JP2015112586
公开(公告)号 JP2016222850A 公开(公告)日 2016-12-28
公开国别 JP 申请人省市代码 全国
申请人 DAICEL CORP
简介 PROBLEM TO BE SOLVED : To provide a curable silicone resin composition for forming materials (a sealing material, a lens, etc.) which hardly cause an increase in hardness, a reduction in weight, and a decrease in transparency. SOLUTION : The curable silicone resin composition contains the following components (A), (B), (C) and (D) : (A) a polyorganosiloxane having one or more hydrosilyl groups in the molecule and having no aliphatic unsaturated group; (B) a branched polyorganosiloxane having one or more alkenyl groups in the molecule; (C) a hydrosilylation catalyst containing a platinum group metal; and (D) a rare earth metal compound. SELECTED DRAWING : None COPYRIGHT : (C)2017, JPO&INPIT


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