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Resist composition, resist pattern forming method, polymeric compounds, compounds 发明授权

2022-12-24 4160 1034K 0

专利信息

申请日期 2025-06-30 申请号 JP2012237141
公开(公告)号 JP6051013B2 公开(公告)日 2016-12-21
公开国别 JP 申请人省市代码 全国
申请人 東京応化工業株式会社
简介 PROBLEM TO BE SOLVED : To provide a resist composition and a resist pattern formation method that can improve the dissolution contrast in respect to developer and that can improve the lithography characteristic.SOLUTION : The invention is a resist composition which generates acid upon exposure, and whose solubility in respect to a developer changes in accordance with the action from acid, and it contains a base material component (A) whose solubility in respect to a developer changes in accordance with the action from acid, and the invention is characterized in that the base material component (A) contains a polymeric compound (A1) having a constitutional unit (a0) represented by a general formula (a0-1). In the formula, Ris a hydrocarbon group which may have a substituent having 1 to 5 carbon atoms, Rand Rare a hydrocarbon group which may have a substituent and Rand Rmay bond together to form a ring.


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