客服热线:18202992950

A heat-resistant resin composition having excellent thermal conductivity and heat dissipating compon 发明授权

2023-04-11 2470 326K 0

专利信息

申请日期 2026-04-24 申请号 JP2013014085
公开(公告)号 JP6006649B2 公开(公告)日 2016-10-12
公开国别 JP 申请人省市代码 全国
申请人 株式会社タイカ
简介 PROBLEM TO BE SOLVED : To provide a thermally conductive resin composition which is improved in heat resistance or thermal degradation resistance in a low-oxygen atmosphere by containing a specific thermal stabilizer, and to provide a heat dissipation component using the same.SOLUTION : The thermally conductive resin composition for a low-oxygen heating environment, which is obtained by dispersing at least a thermally conductive filler (B) and a thermal stabilizer (C) in a resin (A) and is used in a low-oxygen heating environment, is characterized in that : the thermal stabilizer (C) is a rare earth oxide of a body-centered cubic crystal structure (or a C-type rare earth oxide); and the content of the C-type rare earth oxide is 0.005-100 pts.wt. based on 100 pts.wt. of the resin (A).


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4