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SPATTER ELECTRODE FOR RADIOACTIVE GAS FIXING PROCESSOR AND MANUFACTURING METHOD THEREOF 发明申请

2023-07-01 2060 278K 0

专利信息

申请日期 2025-07-08 申请号 JP2015052361
公开(公告)号 JP2016173254A 公开(公告)日 2016-09-29
公开国别 JP 申请人省市代码 全国
申请人 TOSHIBA CORP; JAPAN ATOMIC ENERGY AGENCY
简介 PROBLEM TO BE SOLVED : To provide spatter electrodes for radioactive gas fixing processor whose manufacturing lead time is short and which can efficiently fix radioactive gas and a manufacturing method thereof. SOLUTION : In manufacturing spatter electrodes 12A and 12B for radioactive gas fixing processor, the following manufacturing method is applied. A composite metal layer 32 is formed around the circumference of a cooling tube of stainless steel 33a constituting the spatter electrodes 12A and 12B by : 1. coating mixed particles 45 with nickel particles of transition metal and yttrium particles of rare earth metal with a spray gun 41 of non-melt coating process; or 2. coating at the same location nickel particles of transition metal 45a and yttrium particles of rare earth metal 45b with individual spray guns 41a and 41b of non-melt coating process. SELECTED DRAWING : Figure 3 COPYRIGHT : (C)2016, JPO&INPIT


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