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LIGHT-COUPLING DEVICE, MANUFACTURING METHOD THEREOF, AND POWER CONVERSION SYSTEM 发明申请

2023-12-18 5290 189K 0

专利信息

申请日期 2025-06-30 申请号 JP2015035604
公开(公告)号 JP2016157860A 公开(公告)日 2016-09-01
公开国别 JP 申请人省市代码 全国
申请人 RENESAS ELECTRONICS CORP
简介 PROBLEM TO BE SOLVED : To enhance a light-coupling device in characteristic. SOLUTION : A light-coupling device has a potting resin PR and an internal mold resin MRI between a light-emitting element LED and a light-receiving element PD. The internal mold resin MRI is a hardened product of a composition including an epoxy resin and a hardening agent, and has a light transmittance. In addition, the internal mold resin MRI includes aromatic rings and an alicyclic compound. Reducing the proportion of the aromatic rings in the epoxy resin in this way, the transformation of the resin can be suppressed. Thus, the reduction in light transmittance of a hardened product of an epoxy resin can be suppressed, and the degradation of the performance of transmitting a light signal can be reduced. SELECTED DRAWING : Figure 1 COPYRIGHT : (C)2016, JPO&INPIT


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