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Deep trench capacitor 发明授权

2023-11-24 4000 733K 0

专利信息

申请日期 2025-06-28 申请号 US14684533
公开(公告)号 US9379177B2 公开(公告)日 2016-06-28
公开国别 US 申请人省市代码 全国
申请人 GLOBALFOUNDRIES Inc
简介 A deep trench capacitor structure including an SOI substrate comprising an SOI layer, a rare earth oxide layer, and a bulk substrate, the rare earth oxide layer is located below the SOI layer and above the bulk substrate, and the rare earth oxide layer insulates the SOI layer from the bulk substrate, and a deep trench capacitor extending from a top surface of the SOI layer, through the rare earth oxide layer, down to a location within the bulk substrate, the rare earth oxide layer contacts the deep trench capacitor at an interface between the rare earth oxide layer and the bulk substrate forming an incline away from the deep trench capacitor.


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