| 申请日期 | 2026-04-28 | 申请号 | JP2016513948 |
| 公开（公告）号 | JP2016518727A | 公开（公告）日 | 2016-06-23 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | National Institute of Aerospace Associates509314792; Administrator of the National aeronautics and space administration page by the United States of America as Ripurezenteddo510149563 | ||
| 简介 | A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a radiation hardened chip package using rare earth elements and mulitlayered structure provides protection against radiation bombardment from alpha and beta particles to neutrons and high energy electromagnetic radiation. | ||
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