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POLISHING MATERIAL, POLISHING MATERIAL SLURRY AND POLISHING TREATMENT METHOD 发明申请

2023-10-21 2070 138K 0

专利信息

申请日期 2025-07-06 申请号 JP2014221049
公开(公告)号 JP2016092045A 公开(公告)日 2016-05-23
公开国别 JP 申请人省市代码 全国
申请人 KONICA MINOLTA INC
简介 PROBLEM TO BE SOLVED : To provide : a polishing material including polishing material particles superior in endurance; a polishing material slurry including such polishing material particles; and a polishing treatment method by use of such a polishing material. SOLUTION : A polishing material of the present invention comprises polishing material particles 10 including at least a cerium oxide. The polishing material particles each have a core-shell structure including at least a core 1A and a shell 2A; the content of cerium included in the shell is 60 mass% or more of the shell. The core includes a carbonate 3A of a rare earth element. The difference between the core and the shell in cerium content is 15 mass% or more. According to infrared spectroscopic measurement, the polishing material particles show absorption originating from a carbonate. The absorbance of the absorption is within a range of 0.2-0.6. SELECTED DRAWING : Figure 1 COPYRIGHT : (C)2016, JPO&INPIT


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