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A room temperature curable resin composition 发明授权

2023-02-28 2220 1310K 0

专利信息

申请日期 2025-07-24 申请号 JP2013142645
公开(公告)号 JP5915599B2 公开(公告)日 2016-05-11
公开国别 JP 申请人省市代码 全国
申请人 Shin Etsu Chemical Co Ltd2060
简介 PROBLEM TO BE SOLVED : To provide a room temperature curable resin composition which has excellent heat resistance, water resistance, humidity resistance, quick curability, storage stability, and especially UV discoloration resistance.SOLUTION : Provided is a room temperature curable resin composition comprising 100 pts.mass of a polymer having at least one alkoxysilyl-ethylene group terminal in one molecule, the group being represented by the following general formula, and 0.001 to 15 pts.mass of an aluminum chelate compound. In the formula, Rand Rare substituted or unsubstituted primary hydrocarbon groups having 1 to 12 carbon atoms, and may be the same or different; and a is 2 or 3.


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