申请日期 | 2025-07-08 | 申请号 | US14943747 |
公开(公告)号 | US20160073497A1 | 公开(公告)日 | 2016-03-10 |
公开国别 | US | 申请人省市代码 | 全国 |
申请人 | BYD COMPANY LIMITED | ||
简介 | Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises : an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof. |
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