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SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 发明申请

2023-08-08 1210 289K 0

专利信息

申请日期 2025-08-04 申请号 US14738730
公开(公告)号 US20160064624A1 公开(公告)日 2016-03-03
公开国别 US 申请人省市代码 全国
申请人 SAMSUNG ELECTRONICS CO LTD
简介 A light emitting device package may include : a package board; a semiconductor light emitting device disposed on the package board; and a color characteristics converting unit having a resin including a wavelength conversion material converting light emitted from the semiconductor light emitting device into light of a different wavelength and glass powder having a glass composition with a rare earth element added thereto and filtering light within a particular wavelength band, and disposed on a path on which light emitted from the semiconductor light emitting device travels.


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