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Rare earth enhanced high electron mobility transistor and its manufacturing method 发明授权

2023-11-07 1590 418K 0

专利信息

申请日期 2025-07-09 申请号 JP2010127224
公开(公告)号 JP5876212B2 公开(公告)日 2016-03-02
公开国别 JP 申请人省市代码 全国
申请人 Rekutifia International Corporation597161115
简介 According to one embodiment, a high electron mobility transistor (HEMT) comprises an insulator layer comprising a first group III-V intrinsic layer doped with a rare earth additive. The HEMT also comprises a second group III-V intrinsic layer formed over the insulator layer, and a group III-V semiconductor layer formed over the second group III-V intrinsic layer. In one embodiment, a method for fabricating a HEMT comprises forming a first group III-V intrinsic layer and doping the first group III-V intrinsic layer with a rare earth additive to produce an insulator layer. The method also comprises forming a second group III-V intrinsic layer over the insulator layer, and further forming a group III-V semiconductor layer over the second group III-V intrinsic layer. A two-dimensional electron gas (2DEG) is formed at a heterojunction interface of the group III-V semiconductor layer and the second group III-V intrinsic layer.


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