| 简介 |
The present invention relates to a light emitting diode (LED) package comprising rare earth metal oxide particles and, more specifically, to an LED package comprising : an LED chip; and an LED sealing member containing a compound represented by chemical formula 1 in a polymer resin. In chemical formula 1 : M_a(OH)_b(CO_3)_cO_d, M is Sc, Y, La, Al, Lu, Ga, Zn, V, Zr, Ca, Sr, Ba, Sn, Mn, Bi, or Ac; a is 1 or 2, b is 0 to 2, c is 0 to 3, and d is 0 to 3, with the proviso that b, c, and d are not 0 at the same time, and b and c are 0 at the same time or not 0 at the same time. The present invention can improve heat insulation efficiency.COPYRIGHT KIPO 2016 |
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