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Sintered silicon nitride, and silicon nitride semiconductor module circuit board 发明授权

2023-01-28 2430 2450K 0

专利信息

申请日期 2025-06-27 申请号 JP2013242515
公开(公告)号 JP5850031B2 公开(公告)日 2016-02-03
公开国别 JP 申请人省市代码 全国
申请人 Hitachi Metals Ltd5083
简介 Provided are a silicon nitride substrate made of a silicon nitride sintered body that is high in strength and thermal conductivity, a method of producing the silicon nitride substrate, and a silicon nitride circuit substrate and a semiconductor module that use the silicon nitride substrate. According to the silicon nitride sintered body, in a silicon nitride substrate consisting of crystal grains 11 of ²-type silicon nitride and a grain boundary phase containing at least one type of rare earth element (RE), magnesium (Mg) and silicon (Si), the grain boundary phase consists of an amorphous phase 12 and a MgSiN 2 crystal phase 13; the X-ray diffraction peak intensity of any crystal plane of a crystal phase containing the rare earth element (RE) is less than 0.0005 times the sum of the diffraction peak intensities of (110), (200), (101), (210), (201), (310), (320) and (002) of the crystal grains of the ²-type silicon nitride; and the X-ray diffraction peak intensity of (121) of the MgSiN 2 crystal phase 13 is 0.0005 to 0.003 times the sum of the X-ray diffraction peak intensities of (110), (200), (101), (210), (201), (310), (320) and (002) of the crystal grains of the ²-type silicon nitride.


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