客服热线:18202992950

LOW TEMPERATURE HIGH RELIABILITY ALLOY FOR SOLDER HIERARCHY 发明申请

2023-06-07 1980 1748K 0

专利信息

申请日期 2025-08-02 申请号 WOGB15052036
公开(公告)号 WO2016012754A2 公开(公告)日 2016-01-28
公开国别 WO 申请人省市代码 全国
申请人 ALPHA METALS INC; SETNA Rohan P
简介 A lead-free, antimony-free solder alloy comprising : (a) from 1 to 4 wt.% silver (b) from 0.5 to 6 wt.% bismuth (c) from 3.55 to 15 wt.% indium (d) 3 wt.% or less of copper (e) optionally one or more of the following elements 0 to 1 wt.% nickel 0 to 1 wt.% of titanium 0 to 1 wt.% manganese 0 to 1 wt.% of rare earths, such as cerium 0 to 1 wt.% of chromium 0 to 1 wt.% germanium 0 to 1 wt.% of gallium 0 to 1 wt.% of cobalt 0 to 1 wt.% of iron 0 to 1 wt.% of aluminum 0 to 1 wt.% of phosphorus 0 to 1 wt.% of gold 0 to 1 wt.% of tellurium 0 to 1 wt.% of selenium 0 to 1 wt.% of calcium 0 to 1 wt.% of vanadium 0 to 1 wt.% of molybdenum 0 to 1 wt.% of platinum 0 to 1 wt.% of magnesium (f) the balance tin, together with any unavoidable impurities.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4