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POLISHING LIQUID, POLISHING LIQUID SET, AND METHOD FOR POLISHING SUBSTRATE 发明申请

2023-08-02 3460 150K 0

专利信息

申请日期 2025-07-07 申请号 JP2014124268
公开(公告)号 JP2016003278A 公开(公告)日 2016-01-12
公开国别 JP 申请人省市代码 全国
申请人 HITACHI CHEMICAL CO LTD
简介 PROBLEM TO BE SOLVED : To provide a polishing liquid capable of polishing an insulating material at a high polishing speed and sufficiently suppressing the polishing speed of a stopper material. SOLUTION : The polishing liquid contains a liquid medium, abrasive grains containing a hydroxide of a tetravalent metal element, a polyoxyalkylene compound, a cationic polymer, and a ≥4C alcohol. The hydroxide of the tetravalent metal element is at least one selected from the group consisting of hydroxides of rare earth metal elements and a hydroxide of zirconium. The content of the polyoxyalkylene compound is 0.02 mass% or more based on the total mass of the polishing liquid. COPYRIGHT : (C)2016, JPO&INPIT


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