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Production method for high-purity lanthanum, high-purity lanthanum, sputtering target composed of 发明授权

2023-02-24 3950 1189K 0

专利信息

申请日期 2025-06-27 申请号 US13883126
公开(公告)号 US9234257B2 公开(公告)日 2016-01-12
公开国别 US 申请人省市代码 全国
申请人 Masahiro Takahata; Takeshi Gohara
简介 A method for producing high-purity lanthanum having a purity of 4N or more excluding rare earth elements other than lanthanum and gas components, wherein lanthanum having a purity of 4N or more is produced by reducing, with distilled calcium, a lanthanum fluoride starting material that has a purity of 4N or more excluding rare earth elements other than lanthanum and gas components, and the obtained lanthanum is subjected to electron beam melting to remove volatile substances. The method for producing high-purity lanthanum, in which Al, Fe, and Cu are respectively contained in the amount of 10 wtppm or less. The method for producing high-purity lanthanum, in which total content of gas components is 1000 wtppm or less. The present invention aims to provide a technique capable of efficiently and stably providing high-purity lanthanum, a sputtering target composed of high-purity lanthanum, and a thin film for metal gate that contains high-purity lanthanum as a main component.


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