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PRINT WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF 发明申请

2023-09-13 1540 908K 0

专利信息

申请日期 2025-08-29 申请号 KR1020150088288
公开(公告)号 KR1020160002361A 公开(公告)日 2016-01-07
公开国别 KR 申请人省市代码 全国
申请人 KYOCERA CIRCUIT SOLUTIONS INC
简介 A printed wiring board has an insulating board with a conductive metal layer formed on both surfaces of an insulating resin and a conductor layer formed on both surfaces of the insulating board and having a different circuit pattern in accordance with a region. The circuit pattern formed on the both surfaces of the insulating board includes a pattern of which line width precision is ± 10 um or less. The thickness of the conductor layer in which the area of the circuit pattern is compact and the thickness of the conductor layer in which the area of the circuit pattern is rare have the following relationship. The thickness of the conductor layer in the compact area divided by the thickness of the conductor layer in the rare area is 0.7 to 1.0.COPYRIGHT KIPO 2016


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