客服热线:18202992950

High-purity erbium, sputtering target comprising high-purity erbium, metal gate film having high-p 发明授权

2023-02-22 3400 1140K 0

专利信息

申请日期 2025-06-28 申请号 AU2011372143
公开(公告)号 AU2011372143B2 公开(公告)日 2015-12-03
公开国别 AU 申请人省市代码 全国
申请人 JX Nippon Mining Metals Corporation
简介 High-purity erbium having : a purity of at least 5N, excluding rare-earth elements and gas components; no more than 1 wt ppm each of Al, Fe, Cu, and Ta; no more than 10 wt ppm of W; no more than 150 wt ppm of carbon; no more than 1 wt ppm each of alkali metals and alkali rare earth metals; no more than 10 wt ppm in total of other transition metal elements; and no more than 10 wt ppb each of the radioactive elements U and Th. The present invention addresses the problem of providing : a method for increasing the purity of erbium, which has a high vapor pressure and is difficult to purify in a molten state; high-purity erbium obtained by said method; and technology capable of efficiently and stably providing a sputtering target comprising high-purity material erbium and a metal gate thin film having the high-purity erbium as the main component.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4