| 简介 |
The invention provides a substrate treating method which can favorably prevent damages to a substrate when the substrate is separated from a support, thus achieving a high yield. The substrate treating method includes, in the sequence set forth, a step 1 of temporarily fixing a substrate onto a support via a temporary fixing material to form a stack, the temporary fixing material including at least a temporary fixing material (I) containing a cycloolefin polymer (A) and a compound (B) having a structure (b1) such as a dialkyl silicone structure, and a structure (b2) such as a polyoxyalkylene structure, a step 2 of processing the substrate and/or transporting the stack, and a step 3 of applying a force to the substrate or the support in a direction substantially perpendicular to the plane of substrate to separate the substrate from the support. |
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