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Cu-Ni-Co-Si-BASED COPPER ALLOY SHEET MATERIAL, MANUFACTURING METHOD THEREOF AND ELECTRIFICATION COM 发明申请

2023-03-29 2630 158K 0

专利信息

申请日期 2025-06-25 申请号 JP2014062488
公开(公告)号 JP2015183263A 公开(公告)日 2015-10-22
公开国别 JP 申请人省市代码 全国
申请人 DOWA METALTECH KK
简介 PROBLEM TO BE SOLVED : To provide a copper alloy sheet material having stably improved strength, conductivity, bendability and stress relaxation resistance at the same time with a high level even with a sheet thickness of less than 0.15 mm. SOLUTION : There is provided a copper alloy sheet material having a composition containing, by mass%, Ni : 1.0 to 3.5%, Co : 0.5 to 1.0%, Si : 0.35 to 1.25% and the total content of Fe, Cr, Mg, Mn, Ti, V, Zr, Sn, Zn, Al, B, P, Ag and rare earth elements of 0 to 1.0 mass% and the balance Cu with inevitable impurities, with (Ni+Co)/Si mass ratio of 3.4 to 4.2, and the number density of second phase particles having a diameter of 500 nm or more of 104/mm2 or less. COPYRIGHT : (C)2016, JPO&INPIT


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