| 简介 |
PROBLEM TO BE SOLVED : To provide a thin sheet (foil) of Cu-[Ni, Co]-Si-based copper alloy having high strength while maintaining good bendability and conductivity.
SOLUTION : There is provided the high strength copper alloy thin sheet material having a sheet thickness of 20 to 60 μm and a chemical composition containing, by mass%, Ni and Co : 2.50 to 5.00% in total, Si : 0.50 to 1.50% and one or more kind of Fe, Cr, Mg, Mn, Ti, V, Zr, Sn, Zn, Al, B, P, Ag, Be and REM (rare earth element) if needed and the balance Cu with inevitable impurities and satisfying 3.5≤(Ni+Co)/Si≤5.0. In the high strength copper alloy thin sheet material, the number density of "superfine second phase particle" having a particle diameter of 3 nm to 10 nm out of second particles existing in a mother phase is 1.0×109/mm2 or more and orientation of a [200] crystal face is kept high.
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