| 申请日期 | 2025-09-08 | 申请号 | US17072367 |
| 公开（公告）号 | US20210376153A1 | 公开（公告）日 | 2021-12-02 |
| 公开国别 | US | 申请人省市代码 | 全国 |
| 申请人 | Taiwan Semiconductor Manufacturing Co Ltd | ||
| 简介 | A memory cell includes a thin film transistor over a semiconductor substrate. The thin film transistor comprising : a ferroelectric (FE) material contacting a word line, the FE material being a hafnium-comprising compound, and the hafnium-comprising compound comprising a rare earth metal; and an oxide semiconductor (OS) layer contacting a source line and a bit line, wherein the FE material is disposed between the OS layer and the word line. | ||
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