申请日期 | 2025-07-11 | 申请号 | JP2012534955 |
公开(公告)号 | JP5757507B2 | 公开(公告)日 | 2015-07-29 |
公开国别 | JP | 申请人省市代码 | 全国 |
申请人 | Public University Corporation Osaka Prefecture505127721 | ||
简介 | The present invention provides an Ni-based intermetallic compound alloy having excellent hardness. The present invention provides an Ni-based dual multi-phase intermetallic compound alloy comprising Ni as a main component, and 5 to 12 atomic % of Al, 11 to 17 atomic % of V and 1 to 5 atomic % of Re, and having a dual multi-phase microstructure including a primary precipitate L1 2 phase and a (L1 2 + D0 22 ) eutectoid microstructure. |
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