| 简介 |
Provided is a silver bonding wire which is less expensive than a gold bonding wire and which can enable a stable connection by means of a combination of a ball bonding method and a stud bump method. A wire (W) contains Ag as a primary component, and the added quantity of Au is 0.9 mass% to 2.6 mass%, the added quantity of Pd is 0.1 mass% to 1.5 mass%, the total added quantity of Au and Pd is 1.0 mass% to 3.0 mass%, the total quantity of one or more elements selected from Ca and rare earth elements is 20 ppm by mass to 500 ppm by mass, and the total quantity of one or more elements selected from Cu and Ni is 1, 000 ppm by mass to 10, 000 ppm by mass. The wire (W) has a 0.2% proof stress to tensile strength ratio of 90% or higher and an intrinsic resistivity of 3.0 μΩ·cm or lower. |
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