| 简介 |
Thin film gallium nitride structures are fabricated by providing a semiconductor-carbon alloy substrate having a dielectric layer on a surface of the substrate, forming trenches in the dielectric layer to expose surface portions of the surface of the substrate, and forming an epitaxial graphene layer on the exposed surface portions of the surface of the substrate. A buffer layer of rare earth metal oxide material is grown epitaxially on the graphene layer. Gallium nitride structures are formed epitaxially on the metal oxide/graphene layers and within the trenches of the dielectric layer, limiting defects by aspect ratio trapping. A stressor layer is formed over the nitride structures. Removing the substrate below the graphene layer allows the nitride structures to be placed on a surrogate substrate. |
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