| 简介 |
本发明系提供一种胶体二氧化矽研磨材，其含有含真球型胶体二氧化矽研磨粒与会合型胶体二氧化矽研磨粒之胶体溶液。; 依据本发明，获得比使用以往之胶体二氧化矽研磨更快速之研磨速率，且抑制基板表面之微小缺陷，可获得高的平滑性。且，亦可利用作为自抛光(lap)面研磨时之氧化铈替代研磨材，可成为解决目前之稀土(rare earth)问题之一部分。 A polishing composition comprising a colloidal dispersion of spherical silica particles and associated silica particles as abrasive is provided. When used in the step of polishing synthetic quartz glass substrates, the polishing composition ensures a higher polishing rate than conventional colloidal silica and is effective for preventing any microscopic defects on the substrate surface, thus providing the substrate with a high smoothness. The polishing composition can be used as the ceria replacement polishing composition for polishing a lapped surface. |
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