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Radiating heat structure for LED lamp 发明申请

2023-07-16 3820 293K 0

专利信息

申请日期 2025-08-07 申请号 KR1020130064248
公开(公告)号 KR1020140142597A 公开(公告)日 2014-12-12
公开国别 KR 申请人省市代码 全国
申请人 LEE KYUNG CHUL
简介 The present invention relates to a heat-releasing structure for an LED lamp, which improves heat-releasing efficiency using a heat-releasing hole formed by extrusion and can be manufactured more easily. Conventional heat-releasing fins or heat-releasing plates have a limit in cooling down a PCB, and in order to solve such a problem, the present invention provides the heat-releasing structure for an LED lamp. For the heat-releasing structure, an installation space is formed inside an extrusion-molded aluminum frame, wherein a PCB is slid into the installation space and combined together; a transparent or semitransparent cover is combined at the bottom of the frame in order to enable the light of LEDs installed on the PCB to be transmitted downwards; a pair of combining parts is formed at both ends on the inner circumferential surface of the frame in order to enable a bolt passing through a bolt hole in a cap to be combined together; and an inwardly connected heat-releasing hole is formed in the frame along the lengthwise direction in a manner that can be manufactured in a single extrusion process. As a result, the present invention has the inwardly connected heat-releasing hole formed in the frame, therefore releases heated inside air to the outside, and enables cold outside air to flow in, thereby maximizing cooling effect on the PCB. In addition, the present invention enables the aluminum frame equipped with the heat-releasing hole to be extrusion-molded in the lengthwise direction, thereby eliminating the need of post-processing and therefore facilitating manufacturing. Since the total surface area of the aluminum frame significantly increases in proportion to the number of ribs connecting separated frame pieces, the present invention can tremendously improve heat-releasing effect.COPYRIGHT KIPO 2015


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